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15 June 2010 |
16 June 2010 |
17 June 2010 |
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Workshop A
SMT Manufacturing in the New Decade – Material, Process, Reliability (Part 1)
By Dr. Jennie Hwang, H-Technologies Group, USA |
Workshop B
SMT Manufacturing in the New Decade – Material, Process, Reliability (Part 2)
By Dr. Jennie Hwang, H-Technologies Group, USA |
Workshop C
Solar Energy in Electronics Industry – An Overview
By Dr. Jennie Hwang, H-Technologies Group, USA
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Workshop D
Integrated Circuit Packaging and Assembly
By Dr. Thomas Dory,
Arizona State University, USA |
Workshop E
Semiconductor Device and Assembly Manufacturing
By Dr. Thomas Dory,
Arizona State University, USA |
Workshop E
Semiconductor Device and Assembly Manufacturing
By Dr. Thomas Dory,
Arizona State University, USA
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Workshop F
Halogen-Free Printed Circuit Board Materials
By Bhanu Sood,
University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE), USA |
Workshop G
Component Authentication and Screening
By Bhanu Sood,
University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE), USA
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Workshop I
Failure Modes and Effect Analysis
By Bong Kong Liang,
Applied Breakthrough Technologies, Malaysia |
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Workshop H
Lean Six Sigma Manufacturing Implementation
By Bong Kong Liang,
Applied Breakthrough Technologies, Malaysia |
Workshop H
Lean Six Sigma Manufacturing Implementation
By Bong Kong Liang,
Applied Breakthrough Technologies, Malaysia |
Workshop J
IPC-A-610D Acceptability of Electronic Assemblies
By A. Vijayendra,
Industry Association Training Centre (IATC), India
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Workshop J
IPC-A-610D Acceptability of Electronic Assemblies
By A. Vijayendra,
Industry Association Training Centre (IATC), India
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Workshop J
IPC-A-610D Acceptability of Electronic Assemblies
By A. Vijayendra,
Industry Association Training Centre (IATC), India
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